دانلود Mentor Graphics HyperLynx v9.4 build 5047703 x86/64 نرم افزار آنالیز و تأیید مدارهای الکتریکی

HyperLynx SI
HyperLynx® Signal Integrity (SI) generates fast, easy and accurate signal integrity analysis in PCB systems design.

HyperLynx SI helps engineers efficiently manage rule exploration, definition and validation, ensuring that engineering intent is fully achieved.

The software is tightly integrated from schematic design through final layout verification. It can quickly and accurately resolve typical high-speed design effects including over/undershoot, ringing, crosstalk and timing.

HyperLynx PI
Identify potential power integrity distribution issues that can interfere with board design logic, and investigate and validate solutions in an easy-to-use, “what-if” environment with HyperLynx® PI.

This intuitive tool gives any member of your design team the ability to quickly and accurately analyze power integrity, without the usual steep learning curve of most power analysis products.

Design team access to these sophisticated power integrity capabilities will help companies reduce prototype spins, shorten time to market, and allow engineers to develop more reliable products.

HyperLynx DRC
HyperLynx® DRC performs PCB design rule checks for issues affecting EMI/EMC, signal integrity, and power integrity.

HyperLynx DRC includes a core set of rule checks, and offers extensive customizability. It accesses database objects through the automation object model (AOM), and allows advanced geometrical operations on these objects. This offers unique access to the design database and allows development of highly variable rule checks.

With support for VBScript and JavaScript, thorough documentation of the AOM and DRC coding standards, and a built-in script debugging environment, this highly customizable product speeds analysis by automating rule checks that would otherwise be performed manually.

HyperLynx 3D EM
HyperLynx® presents a full-wave 3D EM design and verification solution that meets the stringent demands of complete package, PCB and circuit-level simulation and modeling.

Its method-of-moments implementation incorporates automatic 3D geometry model creation, full support for modeling entire interconnect paths on package and board (including bond wires, solder balls and bumps, vias and routing traces), proprietary non-uniform mesh generation and adaptive curve fitting.

Using HyperLynx 3D EM, your engineers can create EM-accurate simulations without requiring structure simplification, ensuring precise results.

HyperLynx Thermal
HyperLynx® Thermal analyzes board-level thermal conditions on placed, partially routed, or fully routed PCBs. It simulates conduction, convection and radiation, and produces temperature profiles, gradients, and excess temperature maps, resolving board and component overheating early in the design process.

By adjusting the design using what-if scenarios, engineers and PCB designers can reduce mean time between failures by as much as 50 percent, improving product quality and ultimately decreasing warranty costs.

HyperLynx Analog
HyperLynx® Analog, delivers truly scalable analog circuit simulation, allowing PCB designers to precisely control simulation parameters and environment.

It extends the capabilities of DxDesigner to include mixed-signal and analog circuit design simulation to significantly reduce cycle time and eliminate design transcription errors.

By leveraging functional simulation early in the design process, design teams can explore alternate circuit technologies and control component cost and manufacturing yields with much greater efficiency than with common prototype-based processes.